White Papers | Sondrel

Integrating high speed IP at 5nm

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Early bump assignment methodology for SoCs in flip chip BGA packages

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The 10 practical steps to model and design a complex SoC

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Functional Safety – a commitment to a safety culture

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Comparing Performance Verification Environment (PVE) and RTL

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Use of wrappers to form interchangeable modules accelerates the implementation of new ASIC designs

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SoC Application Usecase Capture For System Architecture Exploration

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Shortening Leading-Edge ADAS Design Cycles With FlexNoc To Deliver Customer Success

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