In-Car Connectivity SoC Solution

Overview

This engagement for a leading automotive supplier involved the design of a prototype, followed by a full production chip. The chip provides a scalable solution to streamline and improve the connectivity of multiple devices within a vehicle. The challenge of this design was to meet the reliability and longevity requirements that are critical to stringent automotive safety and lifespan criteria. 

The Design

Designed to be compliant with application of ISO 26262:2011-2012 to semiconductors and management of the DFMEA

  • 28nm TSMC 
  • Netlist2GDSII & DfT
  • Area of 25mm2 
  • Frequency 400 MHz 

The Team

The engineering team for this top level hierarchical design engagement was based in Europe. This was an RTL2GDGSII and DfT fixed price project, with tools supplied by Sondrel. 

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