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Reference: YL/29092017/04

Requirements:

- BSEE or MSEE with 5+ years experience

- Strong understanding of backend ASIC design flow, hierarchical physical design strategies and methodologies, and deep sub-micron technology issues

- Familiar with EDA tools, SOC-Encounter experience is a must

- Successful track records of taping out complex, 65nm or below SOC chips.

- Design automation and analysis using scripting languages, particular Tcl and Perl

- Solid knowledge on sign-off methodology and EDA tools for STA, Noise, Power, etc.

- excellent verbal and written communication skills in English.

- Strong Project Management Capability. A self-starter that is motivated and a good team leader/player

- Domain expert and be able to training/lead the Teams

-Able to take multi-assignments from different customers/Teams

-Good communication skill and customer development capability

Responsibilities:

- Development and optimization of high performance and low power SoC physical implementation methodology

- Perform block level and full chip implementation including floor planning, P&R, CTS, timing and power analysis etc.

- Design consulting in customer's offices on physical implementation tasks

- Interfacing with foundry and IP providers on IP imports and test definition

- Leading engineering teams

- Positive and good customer interface

Job Application Form

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