ic automotive design

Delivering IC Design Services for Automotive

IC design has become a fundamental driver of growth in this sector with 20% CAGR rates predicted over the next ten years. Driver and pedestrian safety is being persued through the ADAS design scale towards the autonomous vehicle, advanced infotainment systems are morphing into the connected car and high performance engine bay IC’s are enabling ever greener performance designs.

Sondrel typically delivers engineering services to Tier 1 or Tier 2 in the supply chain, working with ASIC suppliers to ensure conformance to relevant standards. The need to collect multiple sensor and image data, process it in real time and reach safety related decisions requires very large SoC designs at the latest technology nodes. Sondrel’s experience in mobile and communication chips at 28nm, 16nm and below with designs over 500sqmm translates very well and has enabled us to work with some of the market leading semiconductor companies in the automotive sector.

Read and download a case study of a recent customer project - a solution to streamline in-car connectivity:

Take me to the 28nm TSMC automotive case study

Key considerations are the specific design rules associated with HOTL (High Temperature Operating Life) and an understanding of design to Automotive Safety Integrity levels (ISO26262 ASIL A-D). The design must also be tested to a reliability prediction program, SN29500/TR62380.

IC Design ISO26262  


Applying the latest IC Design Techniques to Deliver your Automotive SoC

Sondrel uses the latest verification methodologies to help our clients “shift left” in verification, starting earlier and decreasing time to debug. Sondrel can support your existing approach or enhance your capabilities by providing rapid access to the latest methodologies such as SystemVerilog, assertion based verification (ABV), UVM and metric driven verification. Each of these technologies increases productivity and underpins the successful compliance to automotive standards.

In addition, the latest DfT techniques will be applied to increase the testability of the design and reduce production test times. To meet the quality and reliability requirements of the ISO 26262 and other automotive electronics standards Sondrel has the expertise to insert Logicbist to enable infield and system testing throughout the product life cycle. It can also be used for fast manufacturing test bring up, thereby reducing expensive test time. Internal JTAG P1687 is also supported by Sondrel, IJTAG replaces ad-hoc communication methods for controlling on-chip test structures and embedded instruments enabling higher degrees of interoperability and DfT re-use.

Finally, Sondrel provides cutting edge implementation solutions to help our customers’ achieve challenging PPA and DFM targets. This is enabled by the use of Sondrel’s Helium 8 RTL2GDSII design flow, which is optimized for multiple EDA flows, library vendors and technology nodes, down to 14nm, in terms of power management and timing closure.

All buildings require strong foundations, Sondrel provides the stable controlled hardware design environment on which to enable the complex systems which are used in automotive and which are required to meet the ISO26262 and ASIL standards. The processes and methodology used by Sondrel, underpin the proof of design quality required by our partners to meet these rigorous standards.

We can put together highly skilled design teams in low cost ODC locations for chip verification, DfT and layout.


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